LCD RF Plasma hmanrua te

LCD RF Plasma Equipment hi LCD, OLED, leh flat panel display material dangte surface treatment atana siam, high-performance system a ni. Tunlai thil siamna lama thil phut khauh tak phuhrukna tura duan a ni a, chutah chuan stable processing leh high throughput chu a pawimawh ve ve a ni. System pumpui hi 880mm × 790mm × 1710mm a ni a, vacuum chamber size hi 450mm × 450mm × 450mm a ni. Electrode plate tin hi 410mm × 430mm a ni a, cycle khatah substrate layer panga thleng a rualin process theih a ni.

 

Functional perspective atang chuan equipment hian user-friendly HMI a pe a, chu chuan key process parameters RF output power, vacuum pumping duration, individual treatment segment, leh gas flow rates te direct adjustment a phalsak a ni. Heng settings te hi material hrang hrang emaw process mamawh hrang hrang nena inmil turin rang taka siam danglam theih a ni a, industrial operations atan pawh flexibility leh consistency a pe vek a ni.

Gas delivery system hian independent channel pathum a support a, nitrogen (N2), argon (Ar), hydrogen (H2), leh oxygen (O2) te a handle thei a ni. Flow meter hi 0–200 ml/min range chhunga calibrate a ni a, control accuracy chuan fluctuation chu 5% hnuai lamah a dah a ni. Pneumatic component lian zawng zawng hi SMC-in a supply vek a, chamber sealing hi fluoro-rubber gasket chhe thei loah a innghat a, hei hian boruak mamawh takah hun rei tak-stability a tichiang a ni. Plasma hi self-adaptive RF power supply hmanga siam a ni a, 13.56 MHz-ah a thawk a, a output sang ber chu 1 kW a ni a, hei hian uniform treatment atan energy rintlak tak a pe thei a ni.

Structurally chuan chamber hi high-purity 304 stainless steel atanga siam a ni a, hei hian oxidation leh corrosion a ti tlem thei hle. He system hian vacuum integrity atan dual-seal design a hmang a, chamber hnung lama copper electrode holder te chuan horizontal electrode plate te chu screw lock tam tak hmangin an secure a, hei hian stability leh energy transfer a ti tha zawk a ni. Side support dangte chuan electrode te chu a tichak lehzual a ni. Vacuum balance chu tihchangtlun a ni tawh: rapid-release valve chuan second 5–10 chhungin pressure equalization a phal a, idle time a tihtlem bakah productivity a ti sang bawk.

Operational safety a nih theih nan machine hi fault alarm system dah a ni. Thil thleng danglam tak awm ni, hun leh a chhan a log a, chutih laiin chamber leh workpiece pahnih venhim nan automatic shutdown a trigger bawk.

A hman danah chuan he hmanrua hi flip-chip underfill process atan hman a ni nasa hle. Underfill hmaa plasma tihfai hian surface activation nasa takin a tichak a, wettability a ti tha a, substrate leh encapsulant inkara adhesion a tipung bawk. Chumi avang chuan packaging quality a ti tha mai bakah advanced display leh semiconductor assembly te long-term reliability a ti sang bawk.

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