FPC Vertical Plasma hmanrua hmanga siam a ni
FPC Vertical Plasma Equipment hi rigid-flex PCB leh flexible PCB (FPC) te surface activation atana siam a ni. Plasma technology hmang hian lei chunglam chakna a tipung tha hle a, a hnu lama coating, bonding, printing, emaw copper plating process atana adhesion leh rintlakna a tipung a ni. System hian fully automatic operation a support a, real-time monitoring leh safety protection features a keng tel a, hei hian continuous production neih laiin stable process performance a tichiang a ni.
Function sawifiahna
FPC Vertical Plasma Equipment hmanga siam a ni arigid-flex PCB leh flexible PCB (FPC) te surface activation a ni.. Plasma technology hmang hian lei chunglam chakna a tipung tha hle a, a hnu lama coating, bonding, printing, emaw copper plating process atana adhesion leh rintlakna a tipung a ni. System hian fully automatic operation a support a, real-time monitoring leh safety protection features a keng tel a, hei hian continuous production neih laiin stable process performance a tichiang a ni. FPC surface treatment sang -precision leh high-reliability mamawh production line tan a tha hle.
A bulpui ber (Configuration) 1.1.
Temperature Transmitter a ni
A thuam a niS4-TT-RI-3-5, chu chuan plasma chamber temperature chu real-time monitoring a pe a, chu chuan processing condition tha ber a vawng reng thei a ni.
Power Supply thlak danglam dan
Industrial-grade a niIQ-60F (±15V/24V) a ni a, a man pawh a tlawm hle.power supply hian energy delivery nghet leh dik tak a siam a, plasma output mumal leh dik tak a vawng reng a ni.
Dilna bulpui ber berte
He hmanrua hi hman ber a niFPC surface activation a ni, micro-contaminants te paih chhuakin surface energy leh activity tihpun a ni. Treatment hian a hnu lama process hrang hrang, copper plating, coating, leh bonding te tan adhesion a ti tha a, yield, surface reliability, leh product consistency te nasa takin a tisang a ni. A bik takin high-end electronics siamna atan a tha hle a, chutah chuan precision leh consistency a pawimawh hle.
Technical lam thil chi hrang hrang
Tui lumna Pressure
>1 bar, hun rei tak chhunga temperature control nghet tak neih theihna tur leh key components venhimna tur.
Hriselna humhalhna System
Gas tlakchhamna venna, pressure laka invenna, leh circuit venhimna hmanga thuam a ni a, thil awmdan pangngai lo takah pawh a tha lo zawngin a veng thei a, operator leh production himna a tichiang bawk.
Dilna hlutna
FPC vertical plasma hmanrua hian a pe asurface activation solution tha tak, fing tak leh nghet tak a nielectronics siamtute tan a ni. FPC leh rigid-flex board-te adhesion leh surface performance nasa takin a tichangtlung a, coating, copper plating, leh bonding process-te rintlak leh inmilna a tipung a ni. High{3}}precision temperature control, industrial-grade power supply, leh himna venhimna kimchang tak a neih avangin, system hian hmanrua dam chhung a ti rei a, chutih rualin operational risk leh maintenance cost a ti tlem bawk. High{6}}end electronics siamna, FPC assembly, leh precision packaging atan chuan he hmanrua hi tihhlawhtlinna atana hmanraw pawimawh tak a niyield sang tak, quality mumal tak, leh production rintlak tak a ni.
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